JPH01115153A - 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法 - Google Patents
半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法Info
- Publication number
- JPH01115153A JPH01115153A JP27286487A JP27286487A JPH01115153A JP H01115153 A JPH01115153 A JP H01115153A JP 27286487 A JP27286487 A JP 27286487A JP 27286487 A JP27286487 A JP 27286487A JP H01115153 A JPH01115153 A JP H01115153A
- Authority
- JP
- Japan
- Prior art keywords
- pins
- alloy
- semiconductor package
- pin
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract description 8
- 239000004065 semiconductor Substances 0.000 title description 4
- 238000004519 manufacturing process Methods 0.000 title description 2
- 229910000640 Fe alloy Inorganic materials 0.000 claims abstract description 18
- 238000005219 brazing Methods 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 2
- 238000002513 implantation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 15
- 239000000919 ceramic Substances 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 12
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 229910000833 kovar Inorganic materials 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011120 plywood Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910020598 Co Fe Inorganic materials 0.000 description 1
- 229910002519 Co-Fe Inorganic materials 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27286487A JPH01115153A (ja) | 1987-10-28 | 1987-10-28 | 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27286487A JPH01115153A (ja) | 1987-10-28 | 1987-10-28 | 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01115153A true JPH01115153A (ja) | 1989-05-08 |
| JPH0583188B2 JPH0583188B2 (en]) | 1993-11-25 |
Family
ID=17519831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27286487A Granted JPH01115153A (ja) | 1987-10-28 | 1987-10-28 | 半導体パッケージ用植設配列リードピン及び半導体パッケージ用植設配列リードピンを用いた半導体パッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115153A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459102A (en) * | 1993-02-19 | 1995-10-17 | Ngk Spark Plug Co., Ltd. | Method of electroplating lead pins of integrated circuit package |
-
1987
- 1987-10-28 JP JP27286487A patent/JPH01115153A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459102A (en) * | 1993-02-19 | 1995-10-17 | Ngk Spark Plug Co., Ltd. | Method of electroplating lead pins of integrated circuit package |
| US5580432A (en) * | 1993-02-19 | 1996-12-03 | Ngk Spark Plug Co., Ltd. | Jig for electroplating lead pins of an integrated circuit package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0583188B2 (en]) | 1993-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |